PARIS: Taiwan Semiconductor Manufacturing (TSMC) has begun production of Apple’s A11 chipset that will power the iPhone 8. TSMC had initially targeted to produce the chipset much earlier, but due to issues ‘involving stacking components in the backend integrated fan-out packaging process’, it had been delayed – but they have already been solved.
Apple’s suppliers are gearing up to launch the OLED-based iPhone 8, which could be introduced in September along with the iPhone 7s and iPhone 7s Plus. A separate report from the Chinese-language Economic Daily News earlier this month, which was shared by Digitimes, also suggested that Apple would stick to the original plan.
Sources had claimed that Apple’s suppliers including TSMC, SLP (substrate-like PCB) makers like Zhen Ding Technology, Kinsus Interconnect Technology, and battery supplier Simplo Technology, have managed to improve the yield rates which will allow for volume production of materials in June. It was also supported that iPhone suppliers Foxconn, Winstron and Pegatron had begun recruiting and training process of new workers in China before the mass production of the new iPhone.